Title:
SEMICONDUCTOR RESIN-SEALING MOLD
Document Type and Number:
Japanese Patent JP2582721
Kind Code:
B2
Abstract:
PURPOSE: To save a resin quantity, relieve a time-consuming work of mold design and, further, eliminate the disadvantage of a conventional constitution that a lead frame is not fixed perfectly because of the remnants of resin material adhering to the frame when the leads are processed after a resin sealing process.
CONSTITUTION: A semiconductor resin sealing mold is composed of an upper mold 1 and a lower mold 2 and cavities 3 are formed in the respective surfaces of the upper and lower molds 1 and 2 which are opposite to each other. In this semiconductor resin sealing mold, protruding stripes 4 are provided along the circumferential edge parts of the cavities 3 in order to avoid the leakage of sealing resin material 5. Protruding step parts 6 which are continuous with the protruding stripes 4 and, further, have the same heights from a horizontal plane as the protruding stripes 4 are formed at the facing positions of the respective molds 1 and 2. Facing planes 6a are so formed as to have sizes with which a cut window 7b linked with the sealed part 7a of a frame 7 is tightly closed when the mold is closed. Further, a containing hole 8 for the resin material 5 is opened in the facing plane 6a of the protruding step part 6 of one of the molds 1 and 2. A rod 9 for pushing out the resin material 5 is housed in the containing hole 8 so as to move vertically and the resin material is supplied to the cavities 3 by the rod 9 when the mold is closed.
Inventors:
TSUNEYASU JOJI
Application Number:
JP29901093A
Publication Date:
February 19, 1997
Filing Date:
November 04, 1993
Export Citation:
Assignee:
MAIKURO RISAACHI KK
International Classes:
B29C45/26; B29C45/02; H01L21/56; B29L31/34; (IPC1-7): H01L21/56; B29C45/02; B29C45/26
Attorney, Agent or Firm:
Genyo Hirano