Title:
SEMICONDUCTOR SEALING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2015101654
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor sealing resin composition capable of forming a semiconductor sealing material excellent in heat resistance, a semiconductor sealing material formed using the semiconductor sealing resin composition, and a semiconductor device in which elements are sealed with the semiconductor sealing material.SOLUTION: A semiconductor sealing resin composition contains a bismaleimide-based compound represented by the formula (1), a benzoxazine-based compound represented by the formula (2), a curing catalyst, and an inorganic filler. [Xand Xare each independently a C1-10 alkylene group, a group represented by the formula (3), a group represented by the formula "-SO-" or "-CO-", O, or a single bond; Rand Rare each independently a C1-6 hydrocarbon group; a are each independently an integer from 1 to 4; and b are each independently from 0 to 4.]
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Inventors:
TAKAHAMA KEIZO
YAMASHITA KATSUSHI
OZAKI YUI
YAMASHITA KATSUSHI
OZAKI YUI
Application Number:
JP2013243646A
Publication Date:
June 04, 2015
Filing Date:
November 26, 2013
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08G14/12; C08G14/073; H01L23/29; H01L23/31