To provide a semiconductor sensor device which can suppress the degradation of reliability even when it forms a resin sealed package configuration in order to simplify manufacturing processes.

A frame body part 11, a weight part 12 arranged inside the frame body part 11, and a flexible part 13 swingably supporting the weight part 12 on the frame body part 11 are included. A sensor element 10 detecting a physical quantity according to the displacement amount of the weight part 12, a lead frame 1 fixing the sensor element 10 on its top surface, and at least a sealing resin layer 30 sealing the sensor element 10 are provided. A recessed part 2 having a predetermined depth in the thickness direction from the top surface is formed in at least a region of the lead frame 1 corresponding to the region inside the frame body part 11.