Title:
SEMICONDUCTOR SENSOR
Document Type and Number:
Japanese Patent JPH1164369
Kind Code:
A
Abstract:
To provide a semiconductor sensor in which an acceleration sensor chip can be fixed to a package in a simple operation with the acceleration sensor chip in parallel with the package.
A package 1 is a housing provided with a bottom part formed of an outer surface 13 and an inner surface 2 with a main surface 2a parallel to the outer surface 13. Bulged parts 3, 3,... with which the lower surface 8a of an acceleration sensor chip 8 in the shape of a rectangular parallelepiped can be in contact are formed on the inner surface 2 of the package 1. Here, when the chip 8 is mounted on the inner surface 2, the chip 8 is supported by the bulged parts 3, 3... with the lower surface 8a of the chip 8 in parallel with the main surface 2a.
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Inventors:
NODERA KENICHI
SUZUKI SHOGO
ICHINO MASAYA
AZUMA AKIHIRO
SUZUKI SHOGO
ICHINO MASAYA
AZUMA AKIHIRO
Application Number:
JP22987697A
Publication Date:
March 05, 1999
Filing Date:
August 26, 1997
Export Citation:
Assignee:
NIPPON INTER ELECTRONICS CORP
International Classes:
G01P15/12; G01P15/08; H01L29/84; (IPC1-7): G01P15/12; H01L29/84
Attorney, Agent or Firm:
Hiroshi Arafune (1 person outside)