Title:
半導体記憶装置
Document Type and Number:
Japanese Patent JP5868381
Kind Code:
B2
Inventors:
Masaru Yano
Application Number:
JP2013250219A
Publication Date:
February 24, 2016
Filing Date:
December 03, 2013
Export Citation:
Assignee:
Winbond Electronics Corporation
International Classes:
G11C16/02; G11C16/04
Domestic Patent References:
| JP2009522703A | ||||
| JP2010211883A | ||||
| JP2006318584A | ||||
| JP2000048582A |
Attorney, Agent or Firm:
Kyozo Katayose