PURPOSE: To use one kind of semiconductor storage circuit chips to constitute plural storage devices having different specifications by using a 1st and 2nd bonding pads only in case of using an optional circuit formed in the circuit chip to connect both the bonding pads to external pins.

CONSTITUTION: An output enable signal the inverse of OE is supplied to an external pin 21 connected to a bonding pad 12A and a power supply voltage VCC is supplied to another external pin 21 connected to a bonding bad 12B. Thereby, the pad 12B is set up to the '1' level, a buffer circuit 17 is turned to an operating state and the power supply voltage supplied to the pad 12B is outputted to an internal power supply line 16. Consequently, the storage device acts as a semiconductor storage device having specifications for controlling the output of data read out from a memory circuit 11 to the external based on the output enable signal the inverse of OE.