PURPOSE: To enable a substrate to be handled without the plane thereof being contacted so that even a substrate having a larger diameter can be handled easily, by providing an engaging hole in the plane of the substrate so that the substrate can be handled with the peripheral face of the engaging hole and the outer peripheral face of the substrate being grasped.

CONSTITUTION: An engaging hole 4a is provided approximately at the center of a semiconductor substrate 4. In order to handle the substrate, the pin 5a of a handling jig 5 is inserted into the engaging hole 4a in the semiconductor substrate and a stopper 5b is applied against the outer periphery of the semiconductor substrate 4. The handling jig 5 has a handle 5c. When this handle 5c is pulled with the stopper 5b pushed in the direction as indicated by the arrow, the pin 5a provided vertically on the upper face of the end portion of an arm 5d is moved to the direction opposite to said direction of the arrow and is applied against the peripheral face of the engaging hole 4a. Namely, the outer periphery of the semiconductor substrate 4 and the peripheral face of the engaging hole 4a are grasped by the 'U' shaped bottom face of the stopper 5b and the outer peripheral face of the pin 5a, respectively. Once they are grasped, they can be fixed in this condition. Thus, the substrate can be handled to the next process by an operator grasping the handle 5c.