Title:
半導体スイッチ
Document Type and Number:
Japanese Patent JP5685664
Kind Code:
B2
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Inventors:
瀬下 敏樹
Application Number:
JP2014090351A
Publication Date:
March 18, 2015
Filing Date:
April 24, 2014
Export Citation:
Assignee:
株式会社東芝
International Classes:
H03K17/693; H03K17/22; H03K19/0185
Attorney, Agent or Firm:
Masahiko Hiugaji