To provide a semiconductor device testing equipment with a contact for electrically connecting to a terminal part of an electronic device, and a manufacturing method capable of arranging with a small pitch by improving work precision and lessening plastic deformation and capable of mass production at low cost.

The contact 45 formed on a plate body 42 composed of 1st to 4th columnar parts 46-49 of different height, and a holding part 41 composed of the plate body 42 and the frame body 43 are formed by a silicon substrate, and the surface of the 1st to the 4th columnar parts 46-49 is provided with a conductive metal 52, and the 4th columnar part 49 with the through hole electrode 55 connected with the conductive metal 52.