Title:
SEMICONDUCTOR TRANSFER MEMBER AND SEMICONDUCTOR MOUNTING MEMBER
Document Type and Number:
Japanese Patent JP2016046521
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor transfer member capable of expressing strong gripping force, and suppressing adhesion of contamination to the semiconductor side, and to provide a semiconductor mounting member capable of expressing strong gripping force, and suppressing adhesion of contamination to the semiconductor side.SOLUTION: A semiconductor transfer member 1000 has a transfer base material 100 and a semiconductor mounting member, where the semiconductor mounting member includes a fibrous columnar structure 10, which includes a plurality of fibrous columnar objects 2. The fibrous columnar objects are oriented in a direction substantially perpendicular to the transfer base material, and the coefficient of static friction of the surface of the fibrous columnar structure, on the side opposite from the transfer base material, to the glass surface is 4.0 or more.SELECTED DRAWING: Figure 1
Inventors:
MAENO YOHEI
Application Number:
JP2015156712A
Publication Date:
April 04, 2016
Filing Date:
August 07, 2015
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
H01L21/677; C01B31/02; H01L21/683
Attorney, Agent or Firm:
Katsuto Momii
Yoshida Masayasu
Yoshida Masayasu
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