SEMICONDUCTOR WAFER BOARD - TOSHIBA CERAMICS CO

Title:

SEMICONDUCTOR WAFER BOARD

Document Type and Number:

Japanese Patent JP2005277215

Kind Code:

A

Abstract:

To provide a vertical semiconductor wafer board capable of heating the surface of a semiconductor wafer at a uniform temperature without generating defects on supported parts of the semiconductor wafer.

In the semiconductor wafer board, the thickness of a supporting face 2 for supporting the outer periphery of a semiconductor wafer and that of a support 3 with which the supporting face part 2 is integrally formed are equal (t1=t2), a plurality of supporting faces formed like circular arcs are arranged on the same circle so as to support not less than two thirds of the outer peripheral length of the semiconductor wafer, the supports 3 (3a, 3b) are projected to the outside from the supporting faces and the cross section of each support 3 is non-circular.

Inventors:

INABA TAKESHI
KUROI SHIGEAKI
YAMAGUCHI TOSHIHIRO

Application Number:

JP2004090196A

Publication Date:

October 06, 2005

Filing Date:

March 25, 2004

Export Citation:

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Assignee:

TOSHIBA CERAMICS CO

International Classes:

H01L21/683; H01L21/22; H01L21/31; H01L21/68; (IPC1-7): H01L21/68; H01L21/22; H01L21/31

Attorney, Agent or Firm:

Hisashi Hatano
Shunguchi Sekiguchi

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