SEMICONDUCTOR WAFER CLEANING DEVICE AND MANUFACTURE OF THE SEMICONDUCTOR WAFER

Title:

SEMICONDUCTOR WAFER CLEANING DEVICE AND MANUFACTURE OF THE SEMICONDUCTOR WAFER

Document Type and Number:

Japanese Patent JPH11288911

Kind Code:

A

Abstract:

To provide a wafer device and a manufacture of a wafer device thereof which increase the cleaning effects of both-surface cleaning of a water and place no excessive load on the wafer, when the wafer is clamped by rollers.

This semiconductor wafer cleaning device which clamps the semiconductor wafer W by a couple of cleaning rollers 20 cleans the wafer surface by rotating the cleaning rollers 2 is characterized by that the surface of one of the cleaning rollers W is a polishing pad used for the polishing process of the wafer W. The cleaning rollers 2 are driven by a cleaning roller rotating mechanism and a cleaning roller translating mechanism. Consequently, the wafer surface can effectively be cleaned and excessive load due to the clamping due to the cleaning roller 2 will not be placed on the wafer W.

Inventors:

KAIDO YOSHIE
KAJIWARA JIRO
HOSOKI KANJI
AKASAKA MASAYO
SUZUKI TAKASHI
KIKUOKA KENICHI

Application Number:

JP33825898A

Publication Date:

October 19, 1999

Filing Date:

November 27, 1998

Export Citation:

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Assignee:

MITSUBISHI MATERIALS CORP
OTE TECHNOLOGICAL ENGINEERING

International Classes:

H01L21/304; (IPC1-7): H01L21/304; H01L21/304

Attorney, Agent or Firm:

Masatake Shiga (9 outside)

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