SEMICONDUCTOR WAFER CLEANING DEVICE

Title:

SEMICONDUCTOR WAFER CLEANING DEVICE

Document Type and Number:

Japanese Patent JPH06196465

Kind Code:

A

Abstract:

PURPOSE: To enable a cleaning device where a semiconductor wafer is chemically treated and cleaned with pure water to be enhanced in throughput and to prevent dried water droplet marks and a natural oxide film from being produced on the surface of wafers in transit.

CONSTITUTION: Treating chambers 2, 3, 4, and 5 are continuously connected together, a rotating device 13 equipped with a rotary disc 10 which holds a wafer 11 is made to move through the chambers 2 to 5 one after another. At this point, partitioning panels 22, 32, and 42 of the chambers 2 to 5 are made to recede upwards. Spray nozzles 21, 31, 41, and 51 are provided inside the chambers 2 to 5 respectively, and discharge orifices 23, 33, 43, and 53 of waste liquid are also provided respectively.

Inventors:

DENDA AKIRA

Application Number:

JP34420992A

Publication Date:

July 15, 1994

Filing Date:

December 24, 1992

Export Citation:

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Assignee:

KAWASAKI STEEL CO

International Classes:

B08B3/02; H01L21/304; (IPC1-7): H01L21/304; B08B3/02; H01L21/304

Attorney, Agent or Firm:

Yoshio Kosugi (1 person outside)

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