To reduce possibility of damage on a front face of a wafer by lifting and holding the semiconductor wafer by means of vacuum pressure with its outer circumferential edge alone brought into contact.

The subject device 10 is provided with a plurality of finger parts 22 and a frame 24 provided with these finger parts 22, and the frame 24 is constructed of a handle 26 vertically extending from a front face FF of a wafer W, which is held by means of vacuum pressure applied via a tip part 25 of the each finger part 22, and a manifold part 28 forming a frame path. In the manifold part 28, each of the two finger parts 22 extended from the lower corner parts of its pentagonal shape is arranged at a distance (r) from the center C of the frame 24, while the third finger part 22 extended from the pentagonal shape uppermost corner part is arranged within a distance (r) from the center C, and consequently, the wafer W is clamped only by its outer circumferential edge part M alone.