Title:
SEMICONDUCTOR WAFER HOUSING CASE AND ITS CONVEYING APPARATUS
Document Type and Number:
Japanese Patent JPH06181253
Kind Code:
A
Abstract:
PURPOSE: To make it possible to transport at a high speed semiconductor wafers which can be taken out or in at a plurality of positions without creating backlash or dust during the transport of the semiconductor wafers.
CONSTITUTION: This semiconductor wafer housing case 10 comprises rectangular trays 11, each having a circular recessed portion 11A having an outside diameter almost equal to that of a semiconductor wafer W, and a coupling portion 12 for coupling said trays 11 at one side edge portion in up-and-down direction; and each tray 11 respectively has wafer inserting and removing grooves 11B reaching the circular recessed portions 11A at three sides except the coupling portion 12.
Inventors:
YAMADA YOSHIAKI
IWASAKI JUNJI
IWASAKI JUNJI
Application Number:
JP33190192A
Publication Date:
June 28, 1994
Filing Date:
December 11, 1992
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B65D85/00; B65D85/38; B65D85/86; H01L21/673; H01L21/68; (IPC1-7): H01L21/68; B65D85/00; B65D85/38
Attorney, Agent or Firm:
Soga Doteru (6 people outside)
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