Title:
半導体ウエハー接合体、半導体ウエハー接合体の製造方法および半導体装置
Document Type and Number:
Japanese Patent JPWO2010095593
Kind Code:
A
Inventors:
Toshihiro Sato
Hirohisa Dejima
Masakazu Kawada
Shiroishi 史広
Masahiro Yoneyama
Toyomasa Takahashi
Hirohisa Dejima
Masakazu Kawada
Shiroishi 史広
Masahiro Yoneyama
Toyomasa Takahashi
Application Number:
JP2010052194W
Publication Date:
August 23, 2012
Filing Date:
February 15, 2010
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C09J163/00; C09J161/14; H01L27/14; C09J7/00; C09J11/06; H01L23/02
Attorney, Agent or Firm:
Tatsuya Masuda
Morning ratio One husband
Morning ratio One husband