PURPOSE: To provide a semiconductor wafer polishing device which can be set in a clean room and which is capable of discharging a semiconductor wafer to a following process by wafer carrier normally used in the clean room after washing and drying the semiconductor wafer after polishing without contaminating the clean room.
CONSTITUTION: A polishing part 2 to polish a semiconductor wafer 4 by way of pressing the semiconductor wafer 4 on a turn table 3 while holding the semiconductor wafer 4 by a top ring 5 and a washing part 30 to wash the semiconductor wafer 4 are stored in a case body 1 having a side wall. A bulkhead 22 to separate the polishing part 2 and the washing part 30 is provided, a carrier mechanism to carry the semiconductor wafer 4 after polishing from the polishing part 2 to the washing part 30 through an opening 22a of the bulkhead 22 is provided, and exhaust systems 46, 47 to respectively independently exhaust from the polishing part 2 and the washing part 30 are provided.
TSUJIMURA MANABU (JP)
YAJIMA HIROMI (JP)
HIUGA KAZUAKI (JP)
KODAMA SHOICHI (JP)
IMOTO YUKIO (JP)
AOKI RIICHIROU (JP)
KODERA MASAKO (JP)
SHIGETA ATSUSHI (JP)
MISHIMA SHIRO (JP)
KONO YOSHISUKE (JP)
TOSHIBA CORP (JP)