Title:
SEMICONDUCTOR WAFER POLISHING STATE IDENTIFYING APPARATUS, SEMICONDUCTOR WAFER POLISHING APPARATUS, AND SEMICONDUCTOR WAFER POLISHING METHOD
Document Type and Number:
Japanese Patent JP2005244027
Kind Code:
A
Abstract:
To provide a semiconductor wafer polishing state identifying apparatus, semiconductor wafer polishing apparatus, and semiconductor wafer polishing method in which a state of a polishing pad can be directly measured, while polishing a semiconductor wafer.
A polishing state identifying apparatus comprises: a prism 2 disposed to be abutted to a surface of a polishing pad 5; an optical fiber 1a for introducing a light, with which the surface is irradiated into the prism 2; an optical fiber 1b for deriving a light, which is reflected from the surface from the prism 2; and a photodetector 9 for detecting the reflected light.
Inventors:
YOSHIDA YASUHIRO
Application Number:
JP2004053547A
Publication Date:
September 08, 2005
Filing Date:
February 27, 2004
Export Citation:
Assignee:
RENESAS TECH CORP
International Classes:
B24B49/12; B24B37/20; B24B37/24; H01L21/304; (IPC1-7): H01L21/304; B24B37/00; B24B49/12
Attorney, Agent or Firm:
Kuro Fukami
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai