Title:
SEMICONDUCTOR-WAFER POSITIONING APPARATUS
Document Type and Number:
Japanese Patent JPS61279148
Kind Code:
A
Abstract:
PURPOSE:To perform highly accurate positioning, by pushing the outer periphery of a wafer, which is mounted on a fixed receiving member, with positioning pins, which are protruded on movable receiving bodies, toward the center, and performing position alignment. CONSTITUTION:Each link 16 is provided in a radial attitude in the direction of the radius so that a wafer 1 having the largest outer diameter is placed between positioning pins 19. A turning link body 15 is turned into a standby state so that each movable receiving body 14 comes to the most backed position. Then, the wafer 1 is mounted on the upper surface of a fixed receiving member 11 and on the upper surface of each movable receiving body 14. The turning link body 15 is turned by the turning angle, which is programmed by a control device, in the specified direction by a turning and driving means 20. Then, each positioning pin 19 advances toward the center to the set position. The outer periphery of the wafer 1 is pushed and the wafer is positioned.
Inventors:
YANAGIHARA TADASHI
Application Number:
JP12291485A
Publication Date:
December 09, 1986
Filing Date:
June 04, 1985
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L21/68; G05D3/00; H01L21/67; (IPC1-7): G05D3/00; H01L21/68
Attorney, Agent or Firm:
Masuo Oiwa
Previous Patent: WAFER POSITIONING APPARATUS
Next Patent: SEMICONDUCTOR-WAFER ALIGNING AND CONVEYING APPARATUS
Next Patent: SEMICONDUCTOR-WAFER ALIGNING AND CONVEYING APPARATUS