Title:
半導体ウエーハの加工装置
Document Type and Number:
Japanese Patent JP5184242
Kind Code:
B2
Inventors:
Shuzo Mitani
Application Number:
JP2008194336A
Publication Date:
April 17, 2013
Filing Date:
July 29, 2008
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/677; B24B7/22; H01L21/304
Domestic Patent References:
| JP2008124292A | ||||
| JP2004079569A | ||||
| JP2008053432A | ||||
| JP11145253A | ||||
| JP2005011917A | ||||
| JP2001358096A |
Attorney, Agent or Firm:
Akira Matsumoto
Kenji Ito
Kenji Ito