半導体ウエハの処理方法およびそのための半導体ウエハの転写装置

Title:

半導体ウエハの処理方法およびそのための半導体ウエハの転写装置

Document Type and Number:

Japanese Patent JP4215998

Kind Code:

B2

Abstract:

To provide a treatment method of a semiconductor wafer which enables the semiconductor wafer to be peeled from a supporting substrate without damaging the semiconductor wafer being supported to the supporting substrate via a both-sided adhesive tape, even if the semiconductor wafer is thin, and to provide a transfer device of the semiconductor wafer for it.

After a work 10 whereto a transfer tape T is applied is held between a guide member 36 and a fixing table 32, the transfer tape T is moved along the guide surface 38 of the guide member 36 which guides it in a direction getting away from a supporting substrate 16 of the work 10 fixed to the fixing table 32, and a semiconductor wafer W is peeled from the supporting substrate 16 of the work 10 fixed to the fixed table 32 and transfer to the transfer tape T by carrying the work 10 fixed to the fixing table 32 following the movement of the transfer tape T.

Inventors:

Eigen City
Hori Yone Katsuhiko
Hideo Seno

Application Number:

JP2002128658A

Publication Date:

January 28, 2009

Filing Date:

April 30, 2002

Export Citation:

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Assignee:

LINTEC CORPORATION

International Classes:

C09J7/02; H01L21/683; H01L21/301; H01L21/304; H01L21/68

Domestic Patent References:

JP2001007179A
JP2001358198A
JP2001257222A
JP6291185A
JP9017751A
JP9266183A
JP2000331965A

Attorney, Agent or Firm:

Shunichiro Suzuki
Koji Makimura
Chihata Takahata
Toru Suzuki

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