SEMIFLEXIBLE PAVEMENT BODY AND POWER SUPPLY DEVICE BURYING STRUCTURE

Title:

SEMIFLEXIBLE PAVEMENT BODY AND POWER SUPPLY DEVICE BURYING STRUCTURE

Document Type and Number:

Japanese Patent JP2023166789

Kind Code:

A

Abstract:

To make a semiflexible pavement body have a structure that is suitable to bury a power supply device for contactlessly supplying power to a power reception device provided on a movable body while maintaining resistance against plastic deformation.SOLUTION: A semiflexible pavement body is formed by impregnating an open-graded asphalt mixture layer with cement-based solidifying liquid. The cement-based solidifying liquid permeating a lower layer part contains a high heat conductive material having higher thermal conductivity than the cement-based solidifying liquid.SELECTED DRAWING: Figure 2

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Inventors:

KUBOTA TAKAYUKI
KAWAKAMI YOSHIHIRO

Application Number:

JP2022077569A

Publication Date:

November 22, 2023

Filing Date:

May 10, 2022

Export Citation:

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Assignee:

OHBAYASHI CORP

International Classes:

H02J7/00; E01C7/10; H02J50/12

Attorney, Agent or Firm:

Patent Attorney Corporation Isshiki International Patent Office

Previous Patent: JPWO2023166788

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