Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SEMIOPEN INDUCTION HARDENING COIL
Document Type and Number:
Japanese Patent JPH03183724
Kind Code:
A
Abstract:

PURPOSE: To form a hardened surface layer of a uniform depth in the whole of a work by arranging plural high frequency heating coils having a prescribed shape so that the circular surface of the work can be heated with the separate coils.

CONSTITUTION: Thin semiopen induction hardening coil is composed of a first heating coil 51, a second heating coil 52 having the same shape as the coil 51, a coil 53 connecting one end of the coil 51 to one end of the coil 52, a pair of power supplying coils 54, 55 and a core 59 and high frequency voltage 40 is impressed on ends of the coils 54, 55. The first coil 51 is positioned at one side of the circular surface of a work 10 to be hardened and has the shape of a circular are corresponding to about 1/4 of a circle. The core 59 is formed so as to cover the side faces of the coils 51, 52, 53 not confronting the circular surface to be hardened.


Inventors:
WATANABE HIYOSHI
Application Number:
JP32306089A
Publication Date:
August 09, 1991
Filing Date:
December 12, 1989
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FUJI ELECTRONICS CO LTD
International Classes:
C21D1/10; C21D9/30; (IPC1-7): C21D1/10; C21D9/30
Domestic Patent References:
JPS5648766U1981-04-30
Attorney, Agent or Firm:
Koji Onishi