SEMIPLASTIC BODY CUTTING DEVICE - SUMITOMO KINZOKU KOZAN SIPOREX

Title:

SEMIPLASTIC BODY CUTTING DEVICE

Document Type and Number:

Japanese Patent JP2015013399

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To provide a semiplastic body cutting device easily introducible with a simple constitution and capable of obtaining a smooth cut surface.SOLUTION: Provided is a semiplastic body cutting device of relatively moving mutually parallelly stretched at least a pair of wires 10, 20 toward a semiplastic body 50 and cutting the same. A pair of the wires 10, 20 are separated in the relative movement direction, and also, the cross section of the wire 20 on the rear side has elliptical shape or spindle shape stretched in front and behind or has streamline shape such as drop form whose peak part faces a back direction regarding the relative movement.

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Inventors:

KATO TAKEHIRO
NAKANO SHINSUKE

Application Number:

JP2013140379A

Publication Date:

January 22, 2015

Filing Date:

July 04, 2013

Export Citation:

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Assignee:

SUMITOMO KINZOKU KOZAN SIPOREX

International Classes:

B28B11/14

Domestic Patent References:

JP2011126055A	2011-06-30
JPS63173609A	1988-07-18
JPS59131409A	1984-07-28
JPH09239720A	1997-09-16
JPS5551515A	1980-04-15

Attorney, Agent or Firm:

Tsujikawa 典範
Yamamoto Right clue

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