Title:
感活性光線性又は感放射線性樹脂組成物、パターン形成方法、電子デバイスの製造方法、樹脂
Document Type and Number:
Japanese Patent JP7101773
Kind Code:
B2
Abstract:
The present invention provides an active ray-sensitive or radiation-sensitive resin composition that is less likely to generate defects during both development processes of alkali development and organic solvent development, and also provides a pattern forming method, an electronic device manufacturing method, and a resin. The active ray-sensitive or radiation-sensitive resin composition of the present invention comprises a resin having a repeating unit represented by the formula (1) and a repeating unit having an acid-decomposable group, and a photoacid generator.
Inventors:
Kenyoshi Goto
Takashi Kawashima
Kazunari Yagi
Daisuke Asakawa
Takashi Kawashima
Kazunari Yagi
Daisuke Asakawa
Application Number:
JP2020527497A
Publication Date:
July 15, 2022
Filing Date:
June 24, 2019
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
G03F7/038; C08F16/36; G03F7/039; G03F7/20
Domestic Patent References:
| JP2007010748A |
Foreign References:
| US20060292490 |
Attorney, Agent or Firm:
Hideaki Ito
Fumio Mihashi
Fumio Mihashi
Previous Patent: Myringotomy tube and installation device
Next Patent: METHOD FOR EVALUATING QUALITY OF STABILIZED ZIRCONIA
Next Patent: METHOD FOR EVALUATING QUALITY OF STABILIZED ZIRCONIA