Title:
センサボール及びセンサモジュール
Document Type and Number:
Japanese Patent JP7203537
Kind Code:
B2
Abstract:
To provide a sensor ball and a sensor module enabling obtaining sufficient impact resistance performance assuming a real ball catching action to an electronic device such as a sensor and a communication device, in the sensor ball and the sensor module capable of detecting the behavioral information of a ball.SOLUTION: In a sensor ball and a sensor module, the inside of a hollow capsule is filled with a filler comprising gel or silicone rubber, and an electronic unit for detecting the behavioral information of a ball is housed and supported in the hollow capsule by the filler. In the sensor ball, the outside of the hollow capsule is coated with a cover layer of at least one layer.SELECTED DRAWING: Figure 1
Inventors:
Shohei Shibata
Naruo Joji
Yuri Naka
Yamamoto Michiharu
Masaki Mori
Naruo Joji
Yuri Naka
Yamamoto Michiharu
Masaki Mori
Application Number:
JP2018158843A
Publication Date:
January 13, 2023
Filing Date:
August 28, 2018
Export Citation:
Assignee:
Mitsuno Co., Ltd.
International Classes:
A63B43/00; A63B37/00; A63B69/00
Domestic Patent References:
| JP2005162924A | ||||
| JP3046941U | ||||
| JP2016220904A |
Foreign References:
| KR101644502B1 |
Previous Patent: Method for producing lithium ion conductive oxide
Next Patent: DIGITAL CORDLESS TELEPHONE SYSTEM
Next Patent: DIGITAL CORDLESS TELEPHONE SYSTEM