To provide a sensor chip having a substrate, a cover layer, and a spacer layer sandwiched between the substrate and the cover layer, having a hollow reaction part between the substrate and the cover layer, and not causing a warp accompanying a change of temperature or humidity of environment, and to provide a production method for the sensor chip.
This sensor chip has the substrate, the cover layer, and the spacer layer sandwiched between the substrate and the cover layer, and has the hollow reaction part between the substrate and the cover layer, and a detection means inside the hollow reaction part. The substrate and the cover layer have the same material and thickness, and material and shape of the spacer layer are symmetric to a plane parallel to the substrate, and being at an equal distance from the substrate and the cover layer.
KAIMORI SHINGO
ICHINO MORIYASU
KARUBE MASAO
GOTO MASAO
NAKAMURA HIDEAKI
KURUSU FUMIYO
ISHIKAWA TOMOKO
NAT INST OF ADV IND & TECHNOL
Naomi Kamino
Next Patent: APPARATUS FOR PREPARING SPECIMEN, AND PREPARING AND ANALYZING SYSTEM OF SPECIMEN