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Title:
SENSOR DEVICE AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2006003260
Kind Code:
A
Abstract:

To prevent to the utmost adhesion of an insulator on the periphery of a sensing part, in a sensor device wherein a sensor element having the sensing part and a signal output part are provided on a substrate in the electrically connected state and an electrical connection part to a signal output part in the sensor element is sealed by the insulator in the state where the sensing part is exposed.

This device is equipped with the substrate 10; the sensor element 20 provided on the substrate 10 and having the sensing part; and the signal output part 30 provided on the substrate 10 in the electrically connected state to the sensor element 20, for outputting a signal from the sensor element 20 to the outside. The sensor element 20 is loaded on the substrate 10 through an elastically-deformable adhesive member 40. In the sensor element 20, the electrical connection part to the signal output part 30 is sealed by the insulator 50 in the state where the sensing part 21 is exposed.


Inventors:
Tanaka, Masaaki
Ariyoshi, Hiromi
Mizuno, Chiaki
Application Number:
JP2004000181083
Publication Date:
January 05, 2006
Filing Date:
June 18, 2004
Export Citation:
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Assignee:
DENSO CORP
International Classes:
G01F1/684; G01F1/68; G01F15/00; H01J40/14
Attorney, Agent or Firm:
伊藤 洋二
三浦 高広
水野 史博