To provide a sensor device manufacturing method capable of fixing a reactant to a specific location of a detecting part and its apparatus.
The sensor device manufacturing method for fixing the reactant which specifically reacts with an object to be detected to a specific location of the detecting part formed on a support is provided with a head part for housing the reactant, a reactant supplying part for housing the reactant to be supplied for the head part, a vertically movable part for vertically moving the head part, a table part for placing the support, and a table drive part for moving the table part in horizontal directions. The sensor device manufacturing method comprises a positioning step for moving the table part to a predetermined location by the table drive part and a spotting step for moving the vertically movable part to bring the tip of the head part into contact with the detecting part after the positioning step and spotting the reactant to the detecting part.
OKAYAMA TOYOJI
TERAYAMA MASANORI
ONOUCHI TORU
NISHIGUCHI MASASHI
NIWA KAZUHIRO
SUZUKI MASATO
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