Title:
SENSOR DEVICE, AND MANUFACTURING METHOD OF THE SAME
Document Type and Number:
Japanese Patent JP2017157486
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a sensor device capable of securely bonding a body case and a body cover while reducing a manufacturing cost.SOLUTION: A sensor device 1 comprises: a body case 10A provided with an opening 14; and a body cover 10B assembled to the body case 10A so as to cover the opening 14. The body cover 10B has an overlapping region OR of an area positioned at a peripheral edge of the opening 14, which overlaps the body case 10A, in a peripheral part of the cover. Out of a boundary part between the overlapping region OR of the body cover 10B and the body case 10A of an area overlapping the overlapping region OR, a welding part WP which bonds the body case 10A and the body cover 10B by laser welding is provided for an area having a distance inward from an end surface 10b of the body cover 10B so as to surround the opening 14, by which the body cover 10B is fixed to the body case 10A.SELECTED DRAWING: Figure 8
Inventors:
MIZUSAKI HIROYUKI
NAKAJIMA HIROTAKA
NAKAJIMA HIROTAKA
Application Number:
JP2016041599A
Publication Date:
September 07, 2017
Filing Date:
March 03, 2016
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO
International Classes:
H01H35/00; H01H11/00
Domestic Patent References:
| JP2011216372A | 2011-10-27 | |||
| JP2011105005A | 2011-06-02 | |||
| JP2009170133A | 2009-07-30 |
Attorney, Agent or Firm:
Fukami patent office