Title:
SENSOR DEVICE AND METHOD FOR FIXING SENSOR CHIP
Document Type and Number:
Japanese Patent JP3892065
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To fix a sensor chip comprising a pressure sensitive element coupled to a glass seat to a housing while a fluctuation in characteristics of the pressure sensitive element is prevented.
SOLUTION: A seat 25 of a sensor chip 23 is bonded to a stem 28 by fluorine- based adhesive 29. The stem 28 is thereafter bonded to a bottom of a recess 30 of a housing 11 by fluorine-based adhesive 31. Then fluorine-based adhesive 34 is injected into the bottom 30 to bond the stem 28 and the seat 25 more rigidly. Since heating temperature for hardening the fluorine-based adhesives 29, 31, 34 is low, characteristics of a pressure sensitive element 24 may not alter clue to its thermal influence.
Inventors:
Masaki Takakuwa
Hironobu Baba
Yuichi Yokoyama
Masato Imai
Hironobu Baba
Yuichi Yokoyama
Masato Imai
Application Number:
JP19388395A
Publication Date:
March 14, 2007
Filing Date:
July 28, 1995
Export Citation:
Assignee:
株式会社デンソー
International Classes:
G01L13/06; G01L9/00; G01L19/00; G01L19/04; (IPC1-7): G01L13/06; G01L19/00; G01L19/04
Domestic Patent References:
| JP63211A | ||||
| JP654273B2 |
Attorney, Agent or Firm:
Hirohiko Usui
Daito Kato
Takashi Ito
Daito Kato
Takashi Ito
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