Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SENSOR DEVICE
Document Type and Number:
Japanese Patent JP2008224428
Kind Code:
A
Abstract:

To reduce the number of components and assembling man hour by simplifying the constitution, in a sensor device that has, in a case, a mounting substrate mounted with a sensor element and has a vibration isolation structure for preventing external vibration from transferring to the mounting substrate.

An opening in the lower surface of a case body 15 having a connector section 16 is blocked by a cover 12. The mounting substrate 14 on which components such as the sensor element 17 for angular velocity detection and a signal processing circuit 18 are mounted is attached to an attaching section 12b on the upper surface of the cover 12. The mounting substrate 14 and a terminal 16b of the connector section 16 are electrically interconnected through a flexible lead wire 19. The cover 12 is divided into a bonding section 12a of a rectangular frame shape and the attaching section 12b of a rectangular plate shape, and the vibration isolation member 20 is arranged between them.


Inventors:
HIGUCHI YUJI
Application Number:
JP2007063407A
Publication Date:
September 25, 2008
Filing Date:
March 13, 2007
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DENSO CORP
International Classes:
G01C19/56; G01C19/5783; G01D11/24; G01D11/30; G01P1/02; G01P15/08
Attorney, Agent or Firm:
Tsuyoshi Sato