To provide a sensor device capable of reducing influences given to a sensor element by the heat generated by an IC element.
The sensor device includes a sensor element 1, an IC element 2 and a package 3 storing the sensor element 1 and the IC element 2. The package 3 includes a package body 31 and a package cover 32 joined with the package body 31. The sensor element 1 and the IC element 2 are disposed laterally on a surface of the package body 31. The package cover 32 includes a first cover portion 321 covering the sensor element 1 and a second cover portion 322 covering the IC element 32. The height H2 of the second cover portion 322 from the package body 31 is arranged so that a distance L2 between the IC element 2 and the second cover portion 322 is smaller than a distance L1 between the sensor element 1 and the first cover portion 321.
YAMANAKA HIROSHI
SANAGAWA YOSHIHARU
KIRIHARA MASAO
AKEDA TAKANORI
NAKAMURA TAKESHI
Takeshi Sakaguchi
Hidetoshi Kitade
Nakaishi Haruki
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