Title:
SENSOR DEVICE
Document Type and Number:
Japanese Patent JP2015052470
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To reduce cost of a sensor device.SOLUTION: A sensor device SND includes: a power line PL; and a semiconductor device SD. The semiconductor device SD includes an inductor IND. The inductor IND is formed using a wiring layer (described later while referring to FIG. 3). In a view in a direction perpendicular to the semiconductor device SD, the power line PL overlaps the semiconductor device SD. The semiconductor device SD includes two inductors IND. In the view in the direction perpendicular to the semiconductor device SD, the power line PL extends between the two inductors IND.
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Inventors:
NEMOTO TAKATSUGU
NAKASHIBA YASUTAKA
HASHIMOTO RYUSUKE
UCHIDA SHINICHI
GO KAZUNORI
OE HIROSHI
YOSHIKAWA NORIKO
NAKASHIBA YASUTAKA
HASHIMOTO RYUSUKE
UCHIDA SHINICHI
GO KAZUNORI
OE HIROSHI
YOSHIKAWA NORIKO
Application Number:
JP2013184208A
Publication Date:
March 19, 2015
Filing Date:
September 05, 2013
Export Citation:
Assignee:
RENESAS ELECTRONICS CORP
OSAKI ELECTRIC CO LTD
OSAKI ELECTRIC CO LTD
International Classes:
G01R15/18
Domestic Patent References:
| JP2000174357A | 2000-06-23 | |||
| JPS6153760A | 1986-03-17 | |||
| JPS6153760A | 1986-03-17 |
Foreign References:
| US7990132B2 | 2011-08-02 |
Attorney, Agent or Firm:
Shinji Hayami
Amagi 聡
Amagi 聡
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