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Patent Searching and Data


Title:
SENSOR DEVICE
Document Type and Number:
Japanese Patent JP2018152227
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a sensor device that can be manufactured inexpensively, while having high tightness and high robustness.SOLUTION: A sensor device 1A includes a resin inner housing 20A having a housing space internally and being provided with an opening, an external exposed part placed to cover the opening or to be inserted thereinto, and at least a part of which is exposed to the outside of the inner housing 20A, and a metal outer housing 10A located at the outside of the inner housing 20A so as to house and cover the inner housing 20A. The housing space is sealed for the space at the outside of the inner housing 20A, by sealing between the outside of the inner housing 20A and the external exposed part. At least a part of the external exposed part is also exposed to the outside of the outer housing 10A, by providing a notched part in the outer housing 10A at a position corresponding to a portion of the external exposed part exposed to the outside of the inner housing 20A.SELECTED DRAWING: Figure 7

Inventors:
KOMAI KAZUNARI
Application Number:
JP2017047277A
Publication Date:
September 27, 2018
Filing Date:
March 13, 2017
Export Citation:
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Assignee:
OMRON TATEISI ELECTRONICS CO
International Classes:
H01H35/00; H01H9/02; H01H9/04; H05K5/06
Attorney, Agent or Firm:
Fukami patent office