Title:
SENSOR DEVICE
Document Type and Number:
Japanese Patent JP2022154700
Kind Code:
A
Abstract:
To supply potential of a mount object to a connector while a board case is made of a synthetic resin.SOLUTION: In a sensor device 10, a board case 56 is formed from a synthetic resin. A sensor case has a metal outer case 53 that is electrically connected to a circuit board 40 and abuts on a casing 21A of a sensor. The circuit board 40 is wired so as to supply potential supplied from the casing 21A of the sensor via the outer case 53 to a connector 41 by a wire L11. Accordingly, while the board case 56 is made of a synthetic resin, potential of a mount object of a sensor device 10 can be supplied to the connector 41. Although the outer case 53 and the circuit board 40 may be connected directly by welding or the like, connection becomes easier by electrically connecting both of them by a connection member 90.SELECTED DRAWING: Figure 2
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Inventors:
MORI RAITA
KAWAZU TAKAYOSHI
KAMIYA SATOSHI
KAWAZU TAKAYOSHI
KAMIYA SATOSHI
Application Number:
JP2021057857A
Publication Date:
October 13, 2022
Filing Date:
March 30, 2021
Export Citation:
Assignee:
AZBIL CORP
International Classes:
G01L19/14
Attorney, Agent or Firm:
Shigeki Yamakawa