PURPOSE: To connect a sensor substrate and the wiring electrodes of a long, minute pattern on a circuit substrate and to accelerate automation and high speed of manufacturing processes, by connecting the wiring electrodes of the sensor substrate and the wiring electrodes of the circuit substrate with anisotropic conductive bonding resin.
CONSTITUTION: A plurality of sensors 17 and wiring electrodes 19 of said sensors 17 are provided in a sensor substrate 16. Wirings for driving said sensors 17 and reading the outputs of the sensors and wiring electrodes 21 are provided in a circuit substrate 20. The wiring electrodes 19 of said sensor substrate 16 are connected to the wiring electrodes 21 of said circuit substrate 20 with an anisotropic conductive bonding resin 8. For example, many optical sensors 17 are arranged on the sensor substrate 16 comprising transparent material such as glass. Metal particles, which are sufficiently smaller than the interval between the wiring electrodes, are dispersed in a hot melting type transparent bonding resin, and the anisotropic conductive resin 8 is formed. The resin 8 is screen-printed on the individual wiring 19. The individual wiring 19 of the sensor substrate 16 is aligned with the individual vertical wiring of 21 of the matrix substrate 20. The connection of the wiring electrodes and the bonding of the substrate are performed by thermocompression bonding.
ISHIDOYA MAKIKO
MURATA MASAYOSHI
KOMIYAMA KATSUMI
