To improve the cost and convenience of a sensor element for spectroscopic or optical measurement and a method for manufacturing the same.

A sensor element for spectroscopic/optical measurement includes: a sensor chip 2 having a measuring device 3 for sensing a beam 10; a cap chip 6 fixed to a sensor chip via a vacuum-sealing connector 5; a free space 7 formed between the cap chip and the measuring device and sealed with the connector 5; and a Fresnel zone structure 12 that focuses the incident beam 10 on the measuring device. A Fresnel lens is not realized as a three-dimensional structure on an upper surface of the chip but realized inside of the cap chip. That is, the Fresnel zone structure is formed inside of the cap chip. Therefore, the present invention makes it possible to realize a Fresnel lens, integrated on a cap wafer, which has a flat surface. It is possible to avoid a Fresnel lens taking the form of a three-dimensional structure and to realize the Fresnel lens in a cap wafer or a cap chip.