Title:
SENSOR EQUIPMENT
Document Type and Number:
Japanese Patent JP3866531
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To facilitate assembling of an IC module and simplify the fixing assembly structure of the IC module in sensor equipment having the IC module stored and fixed in a housing and a pair of conductors connected to the IC module.
SOLUTION: A holder assembly 18 comprises a first holder 19 having a storage recess part 21 storing the IC module 12 while holding the tip part of the IC module 12 and an insertion hole 22 capable of inserting the IC module 12 on the side of the storage recess part 21 and extending to the storage recess part 21, and a second holder 20 having a partition part 20a disposed between a pair of the conductors 15 connected to the rear end of the IC module 12, inserted in the insertion hole 22, and holding the rear part of the IC module 12 coating with the first holder 19. The IC module 12 in a state stored in the storage recess part 21 and a holder assembly 18 are covered with the housing 11.
Inventors:
Kazuya Kano
Ichiro Yui
Tsuboi Tsuyoshi
Ichiro Yui
Tsuboi Tsuyoshi
Application Number:
JP2001167109A
Publication Date:
January 10, 2007
Filing Date:
June 01, 2001
Export Citation:
Assignee:
Honda Lock Co., Ltd.
International Classes:
G01P3/488; G01D11/24; G01P1/02; (IPC1-7): G01P3/488
Domestic Patent References:
| JP11183495A | ||||
| JP2000214176A | ||||
| JP2000206130A | ||||
| JP2000508068A |
Attorney, Agent or Firm:
Ken Ochiai
Kazuaki Niki
Kazuaki Niki
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