Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SENSOR MODULE
Document Type and Number:
Japanese Patent JP2002131446
Kind Code:
A
Abstract:

To provide a sensor module with easily manufacturing and assembling that can be miniaturized.

A case 1 integrated with a lens is formed by a lens part 11 with a dome shape and a cylindrical case part 12 that integrally stretches from the lower end of the lens part 11. A sensor 2 is mounted on the upper surface of an attachment plate 3, and a plurality of terminals 21, 22, 23 of the sensor 2 are passed through the plate 3 and a circuit substrate 4 to be projected below and is connected to a circuit element mounted on the substrate 4 at the penetration part of the substrate 4. The sensor 2 is housed in the case 1, and an opening at the lower end of the case 1 is covered with an under plate 5. The terminals 21, 22, 23 are passed through the plate 5 to be projected below. A rib stopper 12a that controls a store position of the sensor 2 is placed inside the case 1. A spacer 31, which has a through hole 31a that the terminals of the sensor 2 can be fitted on the under surface of the plate 3 and controls a space between the plate 3 and the substrate 4, is formed. The hole 31a is formed to a hole with a smaller diameter than diameters of the terminals 21, 22, 23, and the terminals 21, 22, 23 are pressed into the hole 31a.


Inventors:
AMAKASU MIKIO
Application Number:
JP2000320481A
Publication Date:
May 09, 2002
Filing Date:
October 20, 2000
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SEIKO PRECISION KK
International Classes:
G01V8/12; G01J1/02; G01J1/04; G08B13/19; (IPC1-7): G01V8/12; G01J1/02; G01J1/04
Attorney, Agent or Firm:
Kazuko Matsuda