Title:
SENSOR MODULE
Document Type and Number:
Japanese Patent JP2019046762
Kind Code:
A
Abstract:
To provide a sensor module that can improve detection accuracy.SOLUTION: Into a sensor module 1, a substrate assembly 3 is inserted in a case 2 having a bottomed box shape. The substrate assembly 3 is manufactured by mounting a sensor electrode 4 on a printed circuit board 5 together with another sensor component. The case 2 is provided with an electrode arrangement portion in which the sensor electrode 4 is arranged on the back side. The electrode arrangement portion is a generic term including the inner bottom surface of the case 2 and the inner side surface of the case 2. The sensor electrode 4 includes a main electrode portion in surface contact with the inner bottom surface of the case 2 and a flexible portion that deforms in response to the press-fit to the case 2.SELECTED DRAWING: Figure 1
Inventors:
IEDA TAKASHI
USHIRO YOHEI
USHIRO YOHEI
Application Number:
JP2017171965A
Publication Date:
March 22, 2019
Filing Date:
September 07, 2017
Export Citation:
Assignee:
TOKAI RIKA CO LTD
International Classes:
H01H36/00; E05B81/76
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda
Hironobu Onda