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Title:
Sensor module
Document Type and Number:
Japanese Patent JPWO2014073108
Kind Code:
A1
Abstract:
センサモジュール１０は、振動部１１と制御回路部１２を分離して構成し、振動部１１を固定部材１４の接着面１４ａに貼り付けて一体化する。固定部材１４をバンパ２の表面に貼り付けることにより振動部１１をバンパ２の穴３に固定し、制御回路部１２をバンパ２の裏面に取り付けて配線１３で接続する。

Inventors:
Suzuki Ryotaro
Satoru Inoue
Nishimoto Yukio
Application Number:
JP2014545536A
Publication Date:
September 08, 2016
Filing Date:
November 12, 2012
Export Citation:
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Assignee:
Mitsubishi Electric Corporation
International Classes:
G01S7/521; B60R19/48; G01S7/03; G01S15/931
Domestic Patent References:
JPH1144752A1999-02-16
JPH0742726U1995-08-11
JPH10123236A1998-05-15
JP2006250564A2006-09-21
JP2009043473A2009-02-26
JP2006298010A2006-11-02
JPH10123236A1998-05-15
JP2006250564A2006-09-21
JP2009043473A2009-02-26
JP2006298010A2006-11-02
JP2005308639A2005-11-04
JPH029888U1990-01-22
JP2012026805A2012-02-09
JP2010002309A2010-01-07
JPH1144752A1999-02-16
JPH0742726U1995-08-11
Attorney, Agent or Firm:
Hideaki Tazawa
Hamada Hatsune
Nakashima Shigeru
Hideo Kawamura
Tatsuya Sakamoto
Tsujioka Masaaki



 
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