Title:
センサ部品、センサ、及びセンサの製造方法
Document Type and Number:
Japanese Patent JP6658700
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a sensor component, a sensor and a sensor manufacturing method capable of preventing moisture reaching to a holder section along a conducting body of an electric wire from seeping into a sensor body.SOLUTION: A sensor component P comprises: a sensor body 21; a sensor section 20 which has a connection terminal 22 extended from the sensor body 21; and a holder section 30 which holds the sensor section 20. The connection terminal 22 is subjected to resin seal by an external section 40 with the same connected to a conducting body 12 of an electric wire 11. A melt section 50, which melts when the external section 40 is molded, is installed at a position, on an external surface of the holder section 30, where a connection section 23 connecting the connection terminal 22 and the conducting body 12 is separated from the sensor body 21.SELECTED DRAWING: Figure 1
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Inventors:
Hironobu Yamamoto
Kim Kyosuke
Toshinari Kobayashi
Kim Kyosuke
Toshinari Kobayashi
Application Number:
JP2017165236A
Publication Date:
March 04, 2020
Filing Date:
August 30, 2017
Export Citation:
Assignee:
SUMITOMO WIRING SYSTEMS,LTD.
International Classes:
G01P1/02; G01D5/245; G01P3/488
Domestic Patent References:
| JP2014130100A | ||||
| JP2008209197A | ||||
| JP5234522B2 | ||||
| JP5930309B2 | ||||
| JP6108292B2 | ||||
| JP5728867B2 | ||||
| JP5633752B2 | ||||
| JP4964168B2 | ||||
| JP2008268016A | ||||
| JP2003177171A | ||||
| JP6035685B2 | ||||
| JP201672073A | ||||
| JP3866531B2 | ||||
| JP4241267B2 | ||||
| JP6202415B2 |
Attorney, Agent or Firm:
Patent Business Corporation Grund Patent Office