Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SENSOR PROBE INSTALLATION DEVICE
Document Type and Number:
Japanese Patent JPH068898
Kind Code:
A
Abstract:

PURPOSE: To realize a device whose thermal expansion coefficient is little different from that of a structure body and prevents the generation of exfoliation and breakage and possesses high thermal resistance.

CONSTITUTION: A pat-up part 3 is formed on the inner surface of a structure body 2, and a groove 4 for the insertion of a sensor probe 1 is formed on the pat-up part 3, and charged with a ceramic group adhesive 6, and a ceramic groop woven fabric 5 is attached on the surface of the pat-up part 3 by the adhesive 6, and the slip-off of the sensor probe 1 can be prevented, and the sensor probe installation device which possesses heat resistivity, has the little difference of thermal expansion coefficient from the structure body, and with which the exfoliation and breakage due to the thermal stress at the high temperature of a flight body into the atmosphere can be realized.


Inventors:
ATSUMI MOTOHIRO
Application Number:
JP17063092A
Publication Date:
January 18, 1994
Filing Date:
June 29, 1992
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI HEAVY IND LTD
International Classes:
B64G1/66; C04B35/80; C09J1/00; C09J7/02; C09J7/04; G01K1/14; (IPC1-7): B64G1/66; C04B35/80; C09J7/04; G01K1/14
Attorney, Agent or Firm:
Akasaka Saka (2 people outside)



 
Next Patent: UNIT REPLACING DEVICE