Title:
SENSOR PROBE FOR SUBSTRATE INSPECTION AND ITS PRODUCTION METHOD
Document Type and Number:
Japanese Patent JP3415035
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate inspection device and its method capable of inspecting bad circuit substrate with high resolution in wide range.
SOLUTION: In this production method of a sensor probe for substrate inspection, an electrode layer consisting of a multitude of sensor electrodes 40, a lead wire layer consisting of a multitude of lead wires 50 for transmitting signal outward and a bridge layer 41 connecting the electrode layer and the lead wire layer are piled on a silicon plate base 30. The lead wire layer is formed by precipitating aluminum on the base following the first mask pattern and the bridge layer is formed by connecting each of bridge wires 41 extending to vertical direction of the base to each of the lead wires 50 on the lead wire layer and forming aluminum precipitation to let grow in the direction vertical to the base. Each of electrodes of the electrode layer is formed so that a multitude of sensor electrodes extending from each bridge wire to horizontal direction and having a specific area precipitate aluminum following the second mask pattern. In between the electrode layer 40 and the lead wire layer 50, a shield layer 33 is provided.
Inventors:
Yuji Ohdan
Hidetsugu Yamaoka
Hidetsugu Yamaoka
Application Number:
JP22467998A
Publication Date:
June 09, 2003
Filing Date:
August 07, 1998
Export Citation:
Assignee:
O.H.T Co., Ltd.
International Classes:
G01R1/073; G01R31/02; G01R31/302; G01R3/00; G01R31/28; (IPC1-7): G01R31/302; G01R31/02
Domestic Patent References:
| JP8327708A | ||||
| JP6143463A |
Attorney, Agent or Firm:
Yukio Maruyama