SENSOR - YAMATAKE CORP

Title:

SENSOR

Document Type and Number:

Japanese Patent JP2011209009

Kind Code:

A

Abstract:

To provide a sensor which can thermally insulate other electronic components on a substrate from the heat which a resistor emits.

A flow sensor 10 based on an example of this sensor includes the substrate 20 which includes: a lower thermal conductivity than silicon (Si); a heater (resistance element) 31 which is provided on one surface of the substrate 20; and a thermally conductive member which is so provided on the substrate 20 as to surround the heater (resistance element) 31 in a plane view and includes a higher thermal conductivity than the substrate 20, e.g., a thermally conductive member 22 made of silicon (Si) or tungsten (W).

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