センサ - National University Corporation The University of Tokyo

Title:

センサ

Document Type and Number:

Japanese Patent JP7066004

Kind Code:

B2

Abstract:

According to one embodiment, a sensor includes first and second structure bodies, and a detector. The first structure body includes a supporter, and first and second deformable parts supported by the supporter. The second deformable part has at least one of a second length less than a first length of the first deformable part, a second width greater than a first width of the first deformable part, a second thickness greater than a first thickness of the first deformable part, a second Young's modulus greater than a first Young's modulus of the first deformable part, or a second spring constant greater than a first spring constant of the first deformable part. The second structure body is connected to the first structure body. A liquid is provided between the first and second structure bodies. The detector outputs a signal corresponding to a deformation of the first or second deformable part.

More Like This:

JP4860351	Curved surface attachment method and ultrasonic probe
JPS53123946	PHOTO CONTROL ELEMENT
JP5505165	Oscillator

Inventors:

Shimoyama Isao
Nguyen Min Jun
Nguyen Tan Vin
Takanori Usami
Kazuo Watanabe
Takahiro Omori
Kiyoshi Matsumoto

Application Number:

JP2020556479A

Publication Date:

May 12, 2022

Filing Date:

November 12, 2018

Export Citation:

Click for automatic bibliography generation Help

Assignee:

National University Corporation The University of Tokyo
Toshiba Corporation

International Classes:

H04R17/00; G01N29/14; G01N29/24; H04R17/02; H04R19/00; H04R19/04; H04R21/00; H04R23/00

Domestic Patent References:

JP2014089183A

Foreign References:

WO2015111581A1
US20070230721

Attorney, Agent or Firm:

Hyuga Temple Masahiko
Junichi Kozaki
Hiroshi Ichikawa
Satoshi Shirai
Uchida Keito
Takeuchi Isao

Previous Patent: Methods and devices for delivering insulin

Next Patent: Syringe adapter with secure connection