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Title:
Sensors and sensor manufacturing methods
Document Type and Number:
Japanese Patent JP6361687
Kind Code:
B2
Abstract:
A sensor includes: an integrated circuit having a power supply lead, a ground lead and a signal lead; a power supply terminal connected to the power supply lead; a ground terminal connected to the ground lead; a first signal terminal connected to the signal lead; a second signal terminal connected to the first signal terminal; a filter member having one end connected to one of the terminals and another end connected to another one of the terminals; and a sealing body sealing the integrated circuit, the terminals and the filter member. A part of each terminal is exposed from the sealing body.

Inventors:
Takeshi Ito
Takamitsu Kubota
Sadayuki Kono
Application Number:
JP2016095266A
Publication Date:
July 25, 2018
Filing Date:
May 11, 2016
Export Citation:
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Assignee:
株式会社デンソー
International Classes:
G01D5/12; G01P1/02
Domestic Patent References:
JP2012251902A
JP2011106850A
JP2008227446A
JP5302932A
Foreign References:
WO2005073743A1
US20030080730
Attorney, Agent or Firm:
Masaki Hattori



 
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