Title:
SEPARATING METHOD OF SEMICONDUCTOR ELEMENT
Document Type and Number:
Japanese Patent JPS5961143
Kind Code:
A
Abstract:
PURPOSE:To provide an easy method of discerning the defective element of a semiconductor even after fixed on an adhesive sheet by a method wherein the surface of a wafer is copied after the defective element surface is marked, the surface of the wafer is sticked and fixed on the sticky surface of an adhesive sheet, the copied paper is placed on the back of the wafer, and the defective part is marked. CONSTITUTION:A wafer 7 is formed with a plurality of semiconductor elements 2..., which a common electrode 8 is formed in the back, as well an independent electrode 9 is formed on the surface, and a common electrode 8 is used facing upward. The wafer 7 is inspected electrically between the electrodes 8 and 9, and a defective pellet 2' is marked the defective condition by coating ink 10. The defective condition marked surface of the wafer 7 is copied on a copy paper 13. The wafer 7 is sticked on an adhesive sheet 11 with the electrode 8 facing upward. Furthermore, the copied surface of the copy paper 13 is laid on the wafer 7 after exact positioning. Marking is made by pricking the electrode 8 with a cut 15 by a needle point at the corresponding position of the wafer to the defect marking part 14 of the copy paper 13.
Inventors:
OONISHI KAZUNORI
MATSUMURA YASUO
MATSUMURA YASUO
Application Number:
JP17165282A
Publication Date:
April 07, 1984
Filing Date:
September 30, 1982
Export Citation:
Assignee:
NIPPON DENKI HOME ELECTRONICS
International Classes:
H01L21/301; H01L21/66; (IPC1-7): H01L21/78
Attorney, Agent or Firm:
Kansai NEC Corporation