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Patent Searching and Data


Title:
SEPARATING METHOD FOR SOLIDIFIED RESIN
Document Type and Number:
Japanese Patent JPH03290218
Kind Code:
A
Abstract:

PURPOSE: To peel and remove solidified resin on a lead frame without deforming the lead frame by retaining one side edge of the lead frame by means of frame retaining pallets and frame pressors and rotating the other end side of lead frame.

CONSTITUTION: In the case of peeling and removing solidified resin off a lead frame 10, push plates 42 are pushed in the state of clamping and supporting the lead frame 10 by means of frame retaining pallets 30a and 30b and frame pressors 36a and 36b, and pushing up the push plates 42 is stopped in the position where a cull 16 is pressed by a cull pusher 50. Then, push rods 44a and 44b are pushed up to rotate the frame retaining pallets 30a and 30b. Frame retaining pallets 30a and 30b are rotated with supporting shafts 32a and 32b as pivots, and as the solidified resin is adhered to the lower face of the lead frame 10, the same is peeled off by being pushed up on the outer edge side of the lead frame 10.


Inventors:
YANAGISAWA SADAO
Application Number:
JP9269690A
Publication Date:
December 19, 1991
Filing Date:
April 07, 1990
Export Citation:
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Assignee:
YAMADA SEISAKUSHO KK
International Classes:
H01L21/56; B29C45/38; B29L31/34; (IPC1-7): B29C45/38; B29L31/34; H01L21/56
Attorney, Agent or Firm:
Takao Watanuki (1 outside)